Very small outline package (VSOP): even smaller than QSOP; 0.4-, 0.5-, or 0.65-mm pin spacing. Lead counts range from 32 to 176. TIs latest REACH statement is located on our Environmental information page. Very-small Quad Flat Package MQFP. TQFP vs. LQFP How are they different, and are these the only differences? Thus, allowing you to identify which IC package you should use in your next PCB project. TQFP vs LQFP: What is the Difference Between Packages #package #TQFP #LQFP #ic All Rights Reserved, Multilayer PCB- Up To 56 Layers Manufacturing, Rogers PCB Full range of material manufacturer, Rigid Flex PCB Manufacturer 20L Rigid With 8L Flexible, HDI PCB Manufacturer high density interconnect Manufacturing, Low Cost RF PCB Circuit Board Manufacturing, Looking For a Good Aluminum PCB Manufacturer, Heavy Copper PCB Manufacturing Up to 20 OZ, Tursted Prototype PCB Assembly Manufacturer, Full/Partial Turnkey PCB Assembly Manufacturer, High Quality Laser Cut PCB Stencil for SMT Use, Sourcing Electronic Components Fast Quote, Estimate Bom List (Bill of Material) Cost, Different Types of BGA (Ball Grid Array) Packages, An analysis of two extensively used packaging technologies QFP and BGA, Analysis on Plating Copper Process for PCB, A Critical Analysis of 7 Layer PCB and Its Applications, Benefits and Applications of IoT smart home, Best Electrical Equipment Manufacturers in the World. They can have different pin pitch (the distance between pins) and perhaps even a different package size. Now let us advance on to the next section, where we will compare QFPs and QFNs to identify the difference between the two: Here are some differences that will help you differentiate between these two devices. 505 Xinhua Road Xinhua District, Shijiazhuang Hebei China. With this setup in place, this device can dissipate much heat away from the ICs. But do the two function in a similar manner? These increasingly small sizes, especially 0201 and 01005, can sometimes be a challenge from a manufacturability or reliability perspective. If you can't find a land pattern from the IC manufacturer then check very carefully the pin pitch and package size when trying to find a compatible footprint. PPM = (mass of substance / mass of material) * 1,000,000 * total amount of each RoHS substance contained in the material. In additional to the PCB design guidelines in datasheet, which gives general design rule information for PCB design. There are many different types of IC packages and different ways of classifying these package types. LQFP/TQFP LQFP/TQFP LQFP/TQFP is a thinner product than QFP, which helps to reduce product thickness and increase board density, and thin end products increase portability. Due to this heat dissipation this ICs eventually end up having high circuitry levels. These packages involve the utilization of a mold array process (MAP) for molding purposes. 1 Answer Sorted by: 11 VQFP - Very Thin Quad Flat Pack. Bare die supplied without a package. They hence become less robust whenever they experience some nominal CM or OEM practices. The final step in creating a semiconductor device is integrated circuit packaging, which involves encasing the semiconductor material block (on which a given functional circuit isfabricated) in a protective case to protect it from physical harm and corrosion. Copyright 2023 WTWH Media LLC. In surface-mount packaging, the component is mounted directly on the exterior of the PCB. Lead pitches available for TQFPs are 0.4mm, 0.5mm, 0.65mm, 0.8mm, and 1.0mm. Quad Flat J-leaded package The lead has extended from the 4 borders to the side of the packages similar to QFP. Made by Panasonic. In most cases, they share the same moisture level (JEDEC Level 3). QFP The leads on this package extend out from four sides of the package; the leads are either gullwing (L-shaped) or straight. QFJ. Though for commercial use, those ICs may be available in surface-mount packages. A chip carrier is a rectangular package with contacts on all four edges. TQFP - Thin Quad Flat Pack. Even though QFNs are pretty awesome, they bear some snags, which include: If you are a PCB designer, then you probably know that QFN manufacturability is a crucial factor to consider. The following guide hopes to answer these questions. Very-small Quad Flat Package MQFP. A body molded using plastic (opened and without any seal), QFN packages do not have the problem of lead co-planarity, They have tiny footprints; this helps in terms of saving space, These packages utilize regular surface mounting equipment for print circuit board assembly, These packages are relatively thin (they are less than 1mm). Add to cart However, you can get one package molded up using this method due to this construction procedure. Finally and most important, it decides how electrical contacts are laid out from the semiconductor device over a PCB. This exposed pad also gives a solid ground connection. and offer the full pincount range. These IC packages are the surface-mount type with no leads. The first one is if the component can be used on a prototyping board, PCB, or both. Polybrominated biphenyls (PBB): 0.1% (1000ppm), 6. Instead, we recommend that you utilize a pick and place machine to ensure accuracy each time. I had to change this chip so I thought it may be useful to show how to do it with a soldering iron. This is an even smaller version of the SOIC package. Learn more about Stack Overflow the company, and our products. Generally, these packages are extensively utilized by very large-scale and large-scale ICs. While the TQFP has a height less than 1.2mm. 1.00mm 0.80mm 0.65mm SSOP LQFP * These packages are compact versions of the SOP and QFP. Electronics For You Top Fans Winners Announced For January 2023, Electronics For You Top Fans Winners Announced For December 2022, Electronics For You Top Fans Winners Announced For November 2022, Programmable IMU That Enhances Precision And Accuracy, A PMIC That Can Charge Multiple Cell Chemistries, Wireless Communication Solution That Consumes 100x Lower Energy Than Bluetooth, Image Sensors For Space And Power Constrained Wearable Application, How Police Trace Cell Phone Location by Mobile Number or IMEI number, LIVE DIY: Touchless Automatic Wash Basin Using Arduino, Thin Display With An Integrated Display Driver, Future Proof Antennas That Will Offer Support For The Upcoming Wi-Fi7 Standard, Turnkey Optical Module That Can Simplify Development Of Vision System, Motherboards That Can Harness The Full Overclocking Capability of Intels New Processors, IoT Into the Wild Contest for Sustainable Planet 2022. Regular QFP are 2.0 to 3.8mm thick depending on size. Site design / logo 2023 Stack Exchange Inc; user contributions licensed under CC BY-SA. To better understand these packages, a good idea is to understand their classification. TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes. The LQFP is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. There are a variety of surface-mount packages including SOP, small-outline transistor (SOT), and QFP available in the market. Low Profile Quad Flat Pack (LQFP) is a surface-mount IC package with leads extending from all around four sides of the package body. A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27mm (or 1/20inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). A hot air system having top and bottom heaters utilized to remove components. When it comes to QFP, you will see a lot of Low profile Quad Flat Packages (LQFP) and Thin Quad Flat Packages (TQFP). The electrode pads along all four edges serve as the terminals for connection. . Note that as the pin pitch becomes narrower, the lead pins bend more easily. what is the difference between TQFP and LQFP package? How to show that an expression of a finite type must be one of the finitely many possible values? I know these packages have different thickness, but I have a hard time to find a TQFP landpad spec. However, one of the key differences is that the LQFP has gull-wing leads that extend from each of its four sides. Another vendor or manufacturer might use a different scheme. The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies. The main ceramic package manufacturers are Kyocera (Japan), NTK (Japan), Test-Expert (Russia), etc. Socketing such packages is rare and through-hole mounting is not possible. This is one of the most popular package styles. They define pin spacing and et cetera in terms of imperial dimensions rather than metric dimensions. 05_00 | Nov 26, 2021 | PDF | 122 kb. To make sure that these devices are safe, you should store them carefully to minimize the chances of damage. This package allows IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs and thin endproduct profile. PG-LQFP-144-22_Tape and Reel_03 Share. To subscribe to this RSS feed, copy and paste this URL into your RSS reader. The advantage of MAXQFP as compare to standard LQFP/QFP packages will be outlined. Package Size (mm) Lead Count LQFP 7 x 7 32, 48, 64 10 x 10 44, 64, 80 14 x 14 64, 80, 100, 120 20 x 20 144, 176 24 x 24 176 28 x 28 208 LQFP-ep 10 x 10 64 Why does this occur? No: Not compliant to TI Green definition. TQFPs help solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. This section will explore the specifications of each and identify a few more differences. The pins on a QFP IC are usually spaced by anywhere from 0.4mm to 1mm. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. What are the battery-selection criteria for low-power design? For WEEE, ppm calculations are at the component level. Lightweight and thin package solution. The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Generally, large-scale or ultra-large-scale integrated circuits use this type of packaging. Lead pitch values used by CQFP's range from 0.5 mm to 1.27 mm. Main ceramic package manufacturers are Kyocera, NTK, and offer the full pincount range. So I was thinking that maybe TQFP have the same land pattern as QFP. These packages have a single row of pins and have a through-hole mounting style. 06_00 | Nov 12, 2020 | PDF | 1.44 mb . They are thinner, having a body thickness of only 1.44mm, which means that they can be utilized in components that have height issues. A split light system To observe the bottom portion of the QFN package plus the site on the print circuit board. Also, because QFN packages do not have lead, you might face some challenges when you try to desolder these packages. There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards. Packaging terminology Following are definitions for TI common package groups, families, and preference codes, along with other important terminology you may find helpful when evaluating TI's packaging options. At present, it is only used by some analog ICs. Such wire may then be covered with cotton, glass or other materials to make into smart textiles or electronic textiles. They have a height of 1mm and a standard lead-frame footprint of 2.0mm. Pins are numbered counter-clockwise from the index dot. As for the multiple row QFNs, they undergo copper etching processes to produce the number of rows and pins preferred by the manufacturer. This package is a variant of the CERDIP package. The quad flat package (QFP) is basically an integrated circuit package which is surface-mounted and pins on them are spaced anywhere from .4mm-1mm apart. Asking for help, clarification, or responding to other answers. TIs latest RoHS statement is found on our Environmental information page. The leads are vertically arranged along the boundary line of the package, just like SIP but are arranged by mutual folding in zigzag. The tip point of the lead is bent internally like the J shape similar to SOJ. The WEEE Directive (Waste Electrical and Electronic Equipment) has created interest in recyclable metals. Variation of COF, where a flip chip is mounted directly to a flex circuit. The LQFP offers pin counts up to . It only takes a minute to sign up. Quad-flat no-leads (QFN) Ball grid array (BGA) uses the underside of the package to place pads with balls of solder in grid pattern as connections to PCB.[1][3]. The drawing below show the package structure difference between a punched and sawn QFN. The latest AURIX TC3xx microcontrollers are also well-suited for safety-critical applications to support clean, autonomous and connected cars. The number after QFP indicates the . However, some smaller QFPs might have only thirty-two pins, which means they have eight pins on either side. HTQFP, HLQFP, LQFP, MSQFP FOOTPRINT (WAVE SOLDERING) Wave soldering PACKAGE NAME PHILIPS OUTLINE CODE Nx Ny FOOTPRINT DIMENSIONS (mm) PLACEMENT P Ax Ay Bx By C D1 D2 THS W ACCURACY HTQFP32 SOT-547-1 Not suitable for wave soldering. 172-lead (16x16 mm body size) and 100-lead (10x10 mm body size) MAXQFP's and 172 MAXQFP_EP (exposed pad) for automotive industry are introduced. Connect and share knowledge within a single location that is structured and easy to search. All IC packages fall into two broad categories by mounting style through-hole (PTH) and surface-mount (SMT). A low-profile quad flat package (LQFP) is a surface mount integrated circuit package format with component leads extending from each of the four sides. Another dimensional change suffered by this package is board flexure. Amkor's TQFPs are an ideal . This means that they both have the same size. They are used for mainstream cost sensitive applications. See, when it comes to reducing fault rates in reflowing and placement, they tend to encounter some challenges. PQFP (Plastic Quad Flat Package) is a form of chip packaging. Network resistors also use these packages. TQFPs lend themselves well when trying to reduce the overall thickness of your PCB so you can make it more portable. LQFPs have an exposed die pad on the bottom of the package, which is created by an appropriate lead frame down-set. After all, they are both quad-flat packages. Also, this leadless IC package is effective for connecting the IC's silicon die to the printed circuit board. Youtube channel :Taking wierd stuff apart. Low profile and thin quad flat packages (QFP) are classified by Maximum Seated height according to JEDEC definition: Low type (>1.20 mm and <=1.70 mm) and thin type (>1.00mm and <=1.20 mm) but the pitch and package size can vary within each. Nevertheless, we can use both packages in similar applications as they are both low-profile packages. Regular QFPs may display up to 4.0 mm of thickness. QFP integrated circuits vary in terms of formats and also in terms of the number of pins utilized. It is better to design own land pattern based on your design requirements. Seam welding gives rise to significantly less temperature rise in the internal of the package (e.g., the die attach). These are surface-mounted packages with the leads extended out to the four sides of the package. This list was the JIG-101 but was sunset in 2012 and became the IEC 62474 DB at that time. MathJax reference. If you encounter a QFN defect post assembly, you can rework on that particular component by removing and replacing it. Splaying IC pins out in all four directions gets you something that might look like a quad flat package (QFP). It is very popular in Quad Flat Packs. Some manufacturers do not give package information in every datasheet but instead have a catalogue of land patterns in a different document. How do you ensure that a red herring doesn't violate Chekhov's gun? The common zigzag inline packages are ZIP (Zigzag In-line Package) and SZIP (Shrink Zigzag In-line Package). A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Later on we shall then compare and contrast them to see if there lie significant differences between the two. TI reports values at the mass (mg) and ppm level. The common ceramic flatpack packages are CFP (Ceramic Flat Pack) and QCFP (Quad Ceramic Flat Pack). The number of pins utilized in this technology is more than one hundred, making it pretty efficient. In commercial circuits, the preferred mounting is always SMT except for few situations where through-hole is still the ideal choice. Quad flat No-lead packages and Quad flat packages are both pretty impressive devices. 49.00 (inc GST) 41.53 (+18% GST extra) Purchase this product now and earn 1 Robu Point! On the other hand little soldering paste reduces solder spreading. Usually, putting these packages onto a PCB requires an automated procedure involving pick-and-place machines and reflow ovens. The leads are arranged horizontally in two or four rows with surface-mount style. In print circuit board QFP assembly, you can utilize a force convection oven for reflow soldering. The terminals are either J-leaded or leadless. 3. SOIC package is shorter and narrower than DIP. However, you still need to place the component carefully. BGA packages are found on pcDuino and Raspberry Pi boards. Lead counts range from 32 to 256. TO determine the soldering paste volume to use, you should check on the stencil thickness and the stencil aperture. We use our own and third-party cookies to personalize content and analyze web traffic. Regular QFP are 2.0 to 3.8 mm thick depending on size. I made PCBs for HT1632c chips, but they retiring QFP package and switching to LQFP. LQFP (Low Profile Quad Flat Package) LQFP is a kind of QFP whose package body thickness is 1.4 mm and this is the name used by the Japanese Electronics and Machinery Industry according to the new QFP shape specification. usado somente em SMT, no possvel o uso de soquetes ou thru-holes. The pinout can be linear, in two parallel directions, all four sides, or matrix form. Non-standard DIP with smaller 0.07in (1.78mm) pin spacing. Chip on board is a packaging technique that directly connects a die to a PCB, without an interposer or lead frame. The best answers are voted up and rise to the top, Not the answer you're looking for? Amkor offers a broad line of TQFP (Thin Quad Flat Pack) IC packages. Why? Variation of COB, where a chip is mounted directly to a flex circuit. J. What is a word for the arcane equivalent of a monastery? Pins are numbered counter-clockwise from the index dot. specified land pattern in datasheet. Also, note that soldering paste is sensitive to humidity, temperature, and age. rev2023.3.3.43278. There are two-terminal, three-terminal, four-terminal, five-terminal, six-terminal, and more than six-terminal IC packages. The number of pins that a QFP can accommodate means that you should take a lot of care when designing PCBs. Electronic components are available either in discrete or integrated form. A thin quad flat pack (TQFP) provides the same benefits as the metric QFP, but is thinner. TQFP is short for Thin Quad Flat Package, a type of surface-mounted integrated circuit package with connections all around the periphery. These amazingly intricate packages have small balls of solder arranged in a 2D grid on the bottom. Pitch: 0.4-0.8mm Figure 3. These features make them suitable for higher frequency applications. BT resin, ceramic and polyimide resin carrier contains original components with higher cost while QFP contains plastic molding resin and metal sheet lead frame with low cost. It's quite easy to solder these packages and easy enough to probe the individual pins afterwards when testing also. Socketing of these packages is rare and through-hole mounting is not possible. Quad Flat J-leaded package QFP . L3#,Exhibition Bay South,Shenzhen World Exhibition & Convention Center,Fuhai Baoan Shenzhen China, 2021 RAYMING Technology. Because of their small size and heat-dissipating characteristics, QFN IC packages are widely used. Hereby the leads are soldered on top of the package. Rectangular the number of pins that come out of each side is different due to varying lengths. When the print circuit board joins reflow oven, a number of parts start to heat up quicker than others. Since they have a shorter electrical path, they are ideal for QFN electrical applications. The only difference between TQFP and QFP is the thickness, see related questions here and here. Well, this happens due to temperature variation within your reflow oven. Board Assembly Recommendations (General) Share. A platform for enablers, creators and providers of IOT solutions. quad-flat no-leads These are also known as non-packaged ICs. It is commonly used for NOR flash memories and other programmable components. These IC packages have two or four rows of terminals along the edges of the IC. Spacing between pins can vary; common spacings are 0.4, 0.5, 0.65 and 0.80 mm intervals. Thank you, I'm aware of the different pitch variations. Although surface-mount, these devices require specific process for assembly. Yes: fully compliant to EU RoHS, no exemption required, Exempt: fully compliant to EU RoHS, with an exemption applied, RoHS restricted substances ppm calculation. Their positioning and size makes them vulnerable to damage that is hard to fix. There are unique rework stations available for this specific purpose. And the difference between both arrays of packages include: Final Words QFN packaging is the way to go if you want a lightweight option that is easy to handle. Browse other questions tagged, Start here for a quick overview of the site, Detailed answers to any questions you might have, Discuss the workings and policies of this site. LQFP - Low-profile Quad Flat Pack. There is another QFP IC type, but with a different pin structure, called the QFN package. These can be used with breadboards and prototyping boards as well. When working with a PCB design or editing software, you may notice that both the LQFP and TQFP have the same footprint. Expand Post. 05_00 | Sep 22, 2022 | PDF | 3.04 mb. The measurement should hence be pretty accurate. Such packages are standard in large-scale and very large-scale integrated circuits. These packages are manufactured using plastic. While you are at it, you can take things upper a notch by checking for contaminants on the boards surface that might hinder the soldering method. These packages are hermetic. These packages have a single row of pins and have a through-hole mounting style. It would be best to utilize type 4 pastes for this procedure as they are more effective. All ICs are linear, rectangular, or square in shape. The terminals may be through-hole type in needle shape (like PGA (Pin Grid Array), OPGA (Organic pin-grid array), FCPGA (Flip-chip pin-grid array), PAC (Pin array cartridge), CPGA (Ceramic pin-grid array), SPGA (Staggered Pin Grid Array), CGA (Column Grid Array), CCGA (Ceramic Column Grid Array)), surface-mount type with solder ball leads (like BGA (Ball Grid Array), EBGA (Enhanced BGA), eWLB (Embedded wafer level ball grid array), FTBGA (Flex Tape BGA), TFBGA (Thin & Fine-Pitch Ball Grid Array), FBGA (Fine-pitch ball-grid array), LBGA/LFBGA (Low-profile ball-grid array), TEPBGA (Thermally-enhanced plastic ball-grid array), CBGA (Ceramic ball-grid array), OBGA (Organic ball-grid array), TFBGA (Thin fine-pitch ball-grid array), PBGA (Plastic ball-grid array), MAP-BGA (Mold array process ball-grid array), UBGA (Micro ball-grid array), TBGA (Thin ball-grid array), SBGA (Super ball-grid array), and UFBGA (Ultra-fine ball-grid array)) or leadless surface-mount having electrode pads (like LGA (Land Grid Array)). Day Job: Mostly LEDs. Making statements based on opinion; back them up with references or personal experience. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media Privacy Policy, Have a technical question about an article or other engineering questions? The typical body thickness is 1.4 mm. Battery configurations (series and parallel) and their protections, Electromagnetic & Radio Frequency Interference, Renesas and AMD to demo digital front-end design for 5G active antenna systems, STMicroelectronics expands STM32U5 series for IoT and embedded applications, Renesas offers advanced wireless power transmitter technology. These package types have two rows of terminals and a surface-mount mounting style. These differ usually only in lead number, pitch, dimensions, and materials used (usually to improve thermal characteristics). interconnect to the exposed pad. Punch-type QFNs have their package molded into a single-mold-cavity set-up. Most common LGAs are used as a physical interface for microprocessors. Maximum pin count is 352 pins. Low-profile quad flat-package : 1.4 mm high, varying sized and pins on all four sides; Plastic quad flat-pack , a square with pins on all four sides, 44 or more pins; Ceramic quad flat-pack : similar to PQFP; Metric quad flat-pack : a QFP package with metric pin distribution; Thin quad flat-pack , a thinner version of LQFP It is the most common through-hole IC package used in circuits, especially hobby projects. Test-expert 256-pin CQFP packages where decoupling capacitors can be soldered on top of the package.[6]. This page was last edited on 17 February 2023, at 08:18. Use MathJax to format equations. Copper lead-frames are used in TQFPs. Square they have the same number of pins on each side as they have the same length. Wettable Flanks QFNs have an elevation reflecting solder wetting. However, the TQFP has shorter leads than the LQFP. Note that excessive soldering paste causes solder bridging. pjr (Customer) Edited by ST Community July 21, 2018 at 5:40 PM. Polybrominated diphenyl ethers (PBDE): 0.1% (1000ppm). Thermocouples help you monitor QFN surface temperature. Nevertheless, they both have a maximum thickness of 1.4 mm. 0.1in (2.54mm) pin spacing, rows 0.3in (7.62mm) or 0.6in (15.24mm) apart. It does not have any lid, plus it is only composed of two sections: However, these QFNs applications lie in the range of 2 to 3 GHz. Both it and the TQFP are surface-mounted packages. Laser Direct Imaging (LDI) in PCB Manufacturing, All about Active, Passive and Electromechanical Components, Terminology of Electronic Components in PCB Assembly. Normally, electronic components are available in multiple IC packages to suit different phases of product development (like prototyping and production) and suit different circuit design considerations. See QFP, PQFP, CQFP and TQFP. Short story taking place on a toroidal planet or moon involving flying. They connect to these components using wires connected to the chips terminal. The exposed pads are usually soldered to the Printed Circuit Board (PCB) for mechanical, electrical and thermal connection. PQFP packaging information from Integrated Silicon Solution, Inc. https://en.wikipedia.org/w/index.php?title=Quad_flat_package&oldid=1140003139, This page was last edited on 17 February 2023, at 23:37. Most ICs with 6 to 40 pins have at least DIP as one package type. a TQFP-101). A QFP is a surface-mounted IC (integrated circuit) package having gull-wing like leads extending on either side of their four edges. The Low Profile Quad Flat Pack, or LQFP, is a surface-mount IC package with leads extending from all four sides of the package body. To learn more, see our tips on writing great answers. Typically 1mm thick. They have a standard lead-frame footprint of 2mm. These IC packages have a smaller pitch (50 mils) and were designed for US military standardized PCBs. Cadmium (Cd): 0.01% (100ppm), 5. The STM8S microcontroller family reference manual (RM0016) refers to devices in this family as medium-density. Spacing between pins can vary. Advanced ICs are available in BGA packages. Soldering QFNs is pretty crucial in the assembly activity. Is it using the same landpad as for QFP (reflow soldering)? What is an Inductor Impedance Calculator? To increase the number of pins, the spacing was decreased from 50 mil (as found on small outline packages) to 20 and later 12 (1.27mm, 0.51mm and 0.30mm respectively). Nevertheless, please get in touch with us if you have any PCB fabrication inquiries and want to learn more about these topics. However, this is not necessary for the creation of reliable joints. Thermal & mechanical simulation results were performed to prove its advantage over conventional LQFP and LQFP_EP. LQFP is a low profile (1.4mm) version of the QFP. No: Not compliant to EU REACH a restricted substance(s) under REACH Annex XVII is contained outside of allowed application. EXAMPLE: Lead (Pb) in leadframe example: (mass of Lead: 0.006273 mg / total mass of leadframe: 62.730001mg) * 1,000,000 = 100 ppm, Quality, reliability & packaging data download. This is helpful and easy to understand the article for the beginners! In this article, we will discuss some basics of IC packaging and the common IC packages. Stack Exchange network consists of 181 Q&A communities including Stack Overflow, the largest, most trusted online community for developers to learn, share their knowledge, and build their careers.